Joining Technology - Company Ranking(7 companies in total)
Last Updated： Aggregation Period:Jan 14, 2026〜Feb 10, 2026
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Display Company Information
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| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| For details, please contact us or refer to the PDF. | For details, please contact us or refer to the PDF. | ||
| For details, please contact us or refer to the PDF. | For details, please contact us or refer to the PDF. | ||
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Tohoku Techno Arch Co., Ltd.
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- Featured Products
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Tohoku Univ. Technology：Room temperature wafer bonding：T24-033
- overview
- For details, please contact us or refer to the PDF.
- Application/Performance example
- For details, please contact us or refer to the PDF.
Tohoku University Technology: Technology for easy and strong resin/metal bonding: T19-064
- overview
- For details, please contact us or refer to the PDF.
- Application/Performance example
- For details, please contact us or refer to the PDF.
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Tohoku Techno Arch Co., Ltd.
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